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HB710KD Hot Melt spray and extrusion guns for PUR materials. Provides a low cost solution for low to medium production applications.
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MICRO MELT is for use with high performance PUR hot melt adhesive to provide absolute bead control. Typical applications for the C450MM include replacement of cyanoacrylate and sonic weld fusing of cell phone, I pod and othe PDA device covers.
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DYNAMINI provides a unique hopper to grid "melt on demand" technology for bulk pellet/chip hot melt supply. Virtualy eliminates charing and thermal cycle breakdown of adhesive.
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THERMOFLOW SERIES for high flow/high viscosity applications such as insulated glass sealing, pressure sensitive adhesives and butyls. Flowrate: Up to 11 lbs per minute Temperature Range: Ambient to 400 deg F Control Method: Panel mount HMI with footswitch or i/o kit Feed Options: 20L Pails or 200L drums
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